Products
Thermal Setting Conductive Adhesive Film
Clicks： ADD Time：2018-12-27 11:12:57 [Close]
Product View
● Product Series： CBF300、CBF800、FGBF700-M、TSC200、TSC250
● Structure
CBF300,CBF800 and TSC200 series prepared by conductive bonding layer and released
film.
● Features
- Low Moisture Absorption
- Excellent Adhesion Strength with Electroless Gold plating
- Excellent Bonding property of Reliability Test Per the condition 85℃& 85%Rh
● Property
|
ITEM |
CBF800-D40 |
CBF800-D60 |
|
|
Adhesive Thickness |
Before Lamination |
40±5μm |
60±5μm |
|
After Lamination |
28±5μm |
42±5μm |
|
|
Peel Strength （90º Tensile） |
Ni-SUS |
12N/cm |
13N/cm |
|
PI（CCL） |
15N/cm |
17N/cm |
|
|
Electroless Gold plating CCL |
7N/cm |
8N/cm |
|
|
Ground Resistance GND Diameter 1.0mm |
40mΩ |
30mΩ |
|
|
Resin Flow |
< 100μm |
< 100μm |
|
Lamination condition: 170℃×2MPa×180s+Heat Curing 150℃×60min
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